A first value is calculated as a function of data in an nth data block of a backup copy. The opening and chamber are sized and configured to receive at least a portion of a blister card therein. A gradient sensor including a pair of cells spatially located on the semiconductor substrate is provided which are co-operable to provide a second output signal indicative of the temperature gradient across the semiconductor substrate for facilitating calibrating the first output signal. The CFRP and the first intermediate product are firmly adhered together by thermal curing of thermoset plastic located in the boundary of the CFRP and the first intermediate product, by subjecting the thermoset plastic contained in the CFRP prepreg to thermal curing.