This description relates to an integrated circuit device including a semiconductor substrate, an under-bump-metallurgy layer overlying the semiconductor substrate and a copper-containing pillar on the UBM layer. The apparatus includes an antenna for facilitating satellite lock, a fastening mechanism for positioning the antenna for best reception, and a satellite lock indicator for communicating loss of satellite lock. The solution to the tile seed assembly is a full tile assembly including a plurality of tile types. The perceived depth within the regions is altered to provide the ideai or best perceived depth within the region of interest and acceptable or more compressed perceived depths in the other regions.