According to an exemplary embodiment, an amplification module includes a power amplifier configured to receive an RF input signal and provide an RF output signal. The isolated input modules are each configured to lock the other out so that only one input module is providing power to the power supplies for the electronic device. Notably, temporarily lengthening the ramp waveform can be based on adjusting an RZ*CZ time constant. Providing the clock pad, data pad, voltage pad common to the electric fuse circuits in each chip area makes it possible to reduce the size of a scribe area. Next, the wafer is cut so that the pre-base portions are separated from one another and the plurality of bases are thereby formed. The compressive stress of the stress control layer is between about 1 and about 20 GPa.