An overpack is provided for packaging cylinders containing compressed gas. Specifically, a stacked memory device is provided with minimal interconnects. The projection of the first frame part is suitably embodied for being inserted into the recess of the second frame part, and the projection of the second frame part is suitably embodied for being inserted into the recess of the first frame part. The active device also includes an output terminal connected to the control terminal of the second active device, and a common terminal connected to a first circuit node.