Methods and systems for inter-chip communication via integrated circuit package waveguides are disclosed and may include communicating one or more signals between or among a plurality of integrated circuits via one or more waveguides integrated in a multi-layer package. The method includes local heating of the semifinished blank in the region of an intended cutting line of the vehicle seat components to be cut out and cutting out the vehicle seat components from the semifinished blank along the cutting line during or shortly after the heating. The diffraction efficiency of the scale is particularly great if the flanks of the bars of the scales are at an angle of approximately 70 with respect to the measuring direction, i. The processor routine enables execution of the simulation modeler.