In a heat mold device 1 for a guide wire 9, the metallic mold body 2 is made from the material, the thermal expansional coefficient of which is the same of a metallic coild wire 91 to stabilize a shape-forming configuration 94. One of the plates may be a simple plate. An additional bearing rotatably supports the planet carrier or the driving shaft relative to the housing. The control circuitry has an input terminal adapted for electrically connecting to a power source, and a plurality of control terminals for selectively connecting to the electrical appliances respectively.