A microelectronic substrate and method for removing adjacent conductive and nonconductive materials from a microelectronic substrate. According to one embodiment, a method of agent exchange-based order fulfillment may include a number of agents moving along respective paths through an inventory storage area of a materials handling facility. The shafts disposed in rows along the first axis are configured to store intermodal containers of a plurality of lengths. The printing method may be carried out using a common inkjet printer, or a printer of another type may be used to print such a security document. A pair of inserts are positioned in the bore and include tapers that interact with the taper in the bore of the sleeve to expand the sleeve to seal the mounting arrangement.