Methods for making, and structures so made for producing integrated circuit chip packages without forming micro solder balls. The second conductive member is formed on a surface of the first conductive member and is essentially made of a material that is more difficult to oxidize than the first conductive member. An excitation coil is positioned by the guide member and a sensing coil moves with the movable element. A conductive connecting part extending through the insulating layer is provided in the insulating layer.