A multi-channel acousto-optic modulator contains an integrated structure for providing active compensation for transient thermal effects. One of the main surfaces of the photosensitive etching glass substrate is thermally bonded to the first substrate, and the other main surface of the photosensitive etching glass substrate is bonded to the second substrate. In addition, an opening is defined in the upper flat section for holding a sauce container. The microlead further includes a stretching zone proximal to the retention zone.