An indirect cooling liquid embedded package design for use with a computer central processor unit is suitable for thermal management of high heat dissipation electronic components such as server processors. A plurality of fault detection chains extend from adjacent the outer border to within the seal ring. A first STI structure is formed to a first depth and a second STI structure is formed to a second depth. The use of a specialized nozzle and isolation valve allows the pressurized fluid to displace material within the nozzle and runner, ensuring the proper pressure is applied to the plastic resin within the mold during pack and hold while the plasticizing screw can begin its recovery cycle. A plurality of tapering outlet tubes extends therefrom, which is situated in a vessel wall, into the receiving vessel.