A method for manufacturing an integrated circuit package system includes: providing a frame; attaching a leaded package having leads adjacent the frame wherein the leads extend towards a side opposite the frame; and applying a package encapsulant over the leaded package having the leads partially exposed opposite the frame. The external interface may plug into a port on an exterior of the sound-producing device. The air mixing damper includes a plurality of convex portions, and a plurality of concave portions, each of which concave portions is positioned between adjacent pairs of the plurality of convex portions. Over a period of time, not all of the UEs will have data to transmit. A corresponding UE is presented.