A negative-working heat-sensitive material for making a lithographic printing plate by direct-to-plate recording is disclosed. The balloon may be non-compliant or semi-compliant and its behavior may be modified by using the sleeve. Each of the data points are defined by feature values corresponding to the associated features. The semiconductor device may additionally comprise a third potential well not located within a pn junction. An area having a minimum spacing along the longitudinal direction between the conductor patterns arranged in the same plane, in all of the plurality of resin layers, is located in the second portion. The super-resolution layer is formed of a material configured such that voids are generated when the material is irradiated with DC light at a predetermined irradiation power for 1 to 300 seconds.