A dry refractory composition having superior resistance to crack propagation. The method or system maintains signals to the circuit in an initial condition while the circuit is uninitialized, and releases the initial condition following initialization of the circuit. The last metal layer provides sites for solder bump pads used in flip chip interconnection. The slug includes an anti-rotation feature that prevents relative rotation between the slug and the receptacle and a curved abutment surface. By monitoring the receive network lines and determining if there is electrical energy on the cable in the form particular to the type of network supported by the network adaptor card, the host computing device can power-down the transceiver associated with the network adaptor card until an active network connection is detected. The pane is a plastic pane and the frame is formed by in situ foaming of a foam material onto the periphery of the pane, the shape of the pane, in at least one partial area of a connecting region between the pane and the peripheral foam, is configured such that a permanent mechanical, positive interlocking connection is created between the pane and the peripheral foam.