The circuit monitoring device is disclosed. A cavity is formed between the nitride semiconductor film and the substrate in the concave portion. The apparatus obtains an m-month average of the numbers of connection calls during each of the input time periods for each date, based on the statistical information. Sixth shaft is connected to ring gear of second set and carrier of fourth set. The functional component is exposed to the outside of the first housing and located in a position configured to be opposed to the end portion of the camera module. A sending entity sends data packets at a sending rate to the transmission link, which transmits the data packets according to its transmission capability to a receiving entity receiving the data packets at a receiving rate.