An apparatus for mounting semiconductor chips has a pick and place system arranged stationary in vertical direction for the picking, transport and placement of a semiconductor chip onto a substrate. A passive belt or protector plate may be provided to assist the passage of the magnetic media through the applied magnetic field. The apparatus includes projection optical systems, each having an enlargement magnification and forming an image of a pattern of the mask on the substrate. Therefore, it is possible to improve a sound recognition rate, so as to improve fault diagnosis accuracy. The RMS receives post-billing data elements to update the rollover data elements.