A polishing pad for use in polishing a surface of a substrate comprises a pad main body having a polishing surface and a plurality of electrode portions formed within the pad main body and mutually spaced apart in a plane direction of the pad main body. In particular the present invention relates to a fertilizer containing as fertilizing elements Nitrogen N, Phosphor P, Potassium K, meso elements like Calcium Ca, Magnesium Mg, Sulphur S, and micro elements like Iron Fe, Manganese Mn, Zinc Zn, Copper Cu, Boron B and Molybdenum Mo. A highly porous heat conducting reticulated foam block substantially fills a space defined by said spaced apart columnar pins.