An epoxy-free method for manufacturing a faceplate for a laser-CRT that produces a uniform bonding interface between the laser structure and the transparent substrate during faceplate fabrication such that efficient uniform optical output, thermal expansion coefficient matching, and better heat transfer can be achieved. The dimples include polygonal dimples that are arranged such that the sides of adjacent polygonal dimples are substantially parallel to each other, and wherein the land area comprises first spacings and second spacings between adjacent dimples. The holes flow into the base layer through the active layer. If the command sequence satisfies the compound command policy, the compound generation mechanism can generate a compound command for the command sequence automatically or prompt an administrator to allow the compound command to be generated.