1460809835-871784d8-b3a0-46e8-8e7c-e9f8658aa037

For testing for stress-migration failure of interconnect, an interconnect test structure is formed with a first feeder line coupled to a test line by a first no-flux structure, and with a second feeder line coupled to the test line by a second no-flux structure. At least one electrode terminates within the bed at a distance from earthed supporting structure to avoid or reduce the risk of tracking or arcing between the electrode and the supporting structure. The power transmission belt has spans defined by terminations proximate to each of the pulleys. Accordingly, a surface of the core material is prevented from being exposed. If the selected pathway is later damaged, the buses select a new pathway and reroute the power or signal over the new pathway.