A dual access peripheral interface uses a shared data bus for communication with dual master units coupled to a common peripheral device. In a transistor including an oxide semiconductor film, the oxide semiconductor film is provided along a trench formed in an insulating layer. The first winding assembly includes a first conductive conduit helically wound around the first winding leg a first number of turns. An edge of a part of the conductive cover, which faces the contact part of the main terminal contact and is placed at a position adjacent to the first surface of the main body, is bent into the insertion slot.