A method for forming a wiring on a substrate includes the steps of preparing a copper substrate, plating a copper-nickel layer on a portion of the copper substrate, combining the copper substrate with a soft polyimide substrate, and etching the copper substrate. A spring in the door lock frame biases the sliding pin towards a proximal open position. The pressure plate is mounted by means which allow said plate to be moved relative to the heatable pad into a second ironing position in which the pressure plate extends laterally outwardly relative to the heatable pad so that the surface thereof which was facing the heatable pad in its first position now provides the surface on which a garment can be placed for ironing. A first set of bolts secure the flange to the retention plate. The invention also includes methods for modifying a hepatitis C virus polynucleotide, selecting a replication competent hepatitis C virus polynucleotide, detecting a replication competent hepatitis C virus polynucleotide, and identifying a compound that inhibits replication of a hepatitis C virus polynucleotide. A least cost path is determined through the trellis.