A conductive paste is provided which can ensure plating adhesion and joint strength between an external electrode and a ceramic body, and which can prevent sticking between electronic devices. Straps are secured to each of the openings in the sidewalls, each strap having a fastening buckle at the end of the strap for temporary fastening to one of the other straps. Quality of service requirements of higher layer data to be transmitted are determined. Also, auxiliary mechanical components such as nuts and bolts to secure the joint components need not be employed to secure the joint. An assembly method of the aforesaid flooring is advantageously provided capable of simplify the installation operations, specifically in virtue of the use of appropriately configured assembly templates.