For grinding one of axially spaced journal sections of a workpiece each having a cylindrical surface and a pair of shoulder surfaces extending radially outward from the opposite end portions of the cylindrical surface, a rotating grinding wheel is advanced to grind the shoulder surfaces of one journal section and then to grind the cylindrical surface of the one journal section. The method includes a step of reducing tension at sea level of the sealine, by connecting one or more buoyant members to the end of the pipeline. The device has an inclined trench that cuts the p-n main junction at a positive bevel angle from the semiconductor substrate surface on the side of the n-type high impurity concentration layer to penetrate through the substrate for separating it into chips. In one embodiment, a process reads portions of the digital signal data and uses the partial data set to build a visualization of the entire digital signal file.