A method of forming a superconductive device is provided, including providing a substrate having a dimension ratio of not less than about 102, depositing a buffer film to overlie the substrate by ion beam assisted deposition utilizing and ion beam, monitoring spatial ion beam density of the ion beam over a target area, and depositing a superconductor layer to overlie the buffer film. A method receives a first set of images captured by the first camera of the mobile device. The composition of hot melt adhesive according to the present invention has excellent compatibility between raw materials so as to have a completely uniform phase, thereby increasing cohesive energy as the adhesive and having the excellent adhesion to the polar or non-polar surface. The turning rod runs through the turning module side cap to fasten to the lamp tube side cap. The security marking technique is also useful for tracking, authenticating and quality control purposes. Preferably, the method is used in wireless conference systems, with the communication terminal being in the form of a participant unit andor chairman unit.