The present invention relates to resin compositions that are useful for preparing adhesive films, which are, in turn, useful for forming interlayer insulation layers for multi-layered printed wiring boards having an excellent mechanical strength and capable of being roughened by an oxidizing agent. The linking member is arranged so as to passe through a guide hole from near the aperture of the inner door panel and to extend along the plastic mounting panel partly on the far side from the passenger compartment and partly on a near side to the passenger compartment. If only single-ended output is desired, only one of the output nodes is used as an output signal source. The cover and base each have an attachment rim that fits into the grooves when the cover and base are connected to the vessel main part.