Devices and methods for manufacturing a device are presented. The wireless device is provided with at least one receiving chain including an analog to digital conversion stage. At least one vibrating element is acoustically coupled to at least the second plate, and a holder and the second plate are rotated relative to each other about an axis substantially perpendicular to the second plate. Moreover, protection layers having stickiness can further be used to secure components so as to reduce the production cost and enhance the product quality. Further, the integrity monitoring method includes determining a reduced integrity limit based on the output of the RAIM system.