A test probe structure having a planar surface and contact locations matched to test hardware is provided. Via linked data, the software package can be linked to at least one test plan and a requirement collection. Accordingly the connections are capable of carrying very high current, and display good long-term reliability as compared to ACA or ICA particulate interconnects. The secure environment may be a logically distinct portion of the M2M device. The flash memory controller also includes programmable wait state registers. The system has a ski-engaging travel mode and a wheel-engaging travel mode.