An interconnect structure including an alloy liner positioned directly between a diffusion barrier and a Cu alloy seed layer as well as methods for forming such an interconnect structure are provided. The local memory of each computer is maintained substantially the same by updating all computers with every change made to addressed memory locations. Gas and fine particles are allowed to escape through an upper outlet while the coarse fraction of the particles is forced to pass through a second separation zone and subsequently to leave through a lower outlet. A method of manufacturing such pulling means comprises the steps of: weaving a longitudinal portion on a loom of low warp density; and weaving a further longitudinal portion on the loom having high or increasing warp density in the same working step. When the first signal is received, these clocks are set based on the time indicator in the first signal.