A member for a semiconductor device of low price, capable of forming a high quality plating layer on a surface, having heat conductivity at high temperature of more than or equal to 180 Wm\xb7K and toughness that will not cause breaking due to screwing, and will not cause solder breaking due to heat stress when it is bonded to other member with solder, and a production method thereof are provided. As a result, the folding hand saw of the present invention can prevent the saw blade from hurting a user or other people. The upper cover defines four concave portions. In some embodiments, the NIC can work with a standalone processor or control host in order to offload much of the processing to the control host.