1460855306-1425f6ca-bf97-454a-8e1f-f637af1e43b2

Embodiments of the invention provide a robust bonding material suitable for joining semiconductor processing chamber components. The invention uses the resources of technology the cell phone industry uses to operate and locate cell phones. Top clock tree distributions are constructed. To reconstruct a scene, the scene data from multiple caches may be shared over a peer-to-peer type network.