The present invention concerns the improvement of the supercurrent carrying capabilities, i. The CSP includes a chip, a conductor layer for redistribution of the chip pads of the chip, one or two insulation layers and multiple bumps, which are interconnected to respective chip pads by the conductor layer and are the terminals of the CSP. Exemplary regions of operation may include a country or a group of countries. Further aspects are directed to removable tactile feedback label systems including a touch-responsive device.