A semiconductor device, a semiconductor package, and a package stack structure include a semiconductor substrate, a first bonding pad disposed on a first surface of the semiconductor substrate, and a first pillar disposed on the first bonding pad. In one implementation a link control module forms a bidirectional link with another bus interface by separately configuring link widths of an upstream unidirectional sub-link and a downstream unidirectional sub-link. The method includes reading the first and second memory cells to determine a current associated with the first and second threshold voltages. At least one of the corner portions adjacent to the side wall having the folding portion has a seamless curved shape. The pivot movement of the hook from concealed position to deployed position is urged by a second magnet, which second magnet holds the hook in the deployed position, thereby facilitating the setting of the hook in the fish’s mouth. When the bale reaches the desired orientation inside the bale forming chamber, such as when a segment or the cut end of the bale wrap is within a desired angular position, an electro-hydraulic control valve is activated, manually or automatically, to actuate the gate cylinders to open the gate, thereby stopping bale rotation and discharging the bale in the desired orientation.