A thermal ducting system for electronic equipment in an electronic equipment enclosure is provided. An image corresponding to the lesion is obtained from each beam direction, and the beam shape and image are fixed to a common coordinate system to facilitate alignment. So the edge of the compound blade is only formed of the flexible layer after the flexible layer combined with the rigid layer. The dust cap includes a housing adapted to engage the first end of the connector body to releasably couple the dust cap to the fiber optic connector and protect the end face of the optical fiber.