Conductive plug structures suitable for stacked semiconductor device package is provided, wherein large contact region between the conductive plug structures and the corresponding pads of devices can be achieved, to reduce electrical impedance. The monitoring system includes a processor configured to communicate with the memory and the interface. The support housing includes an adjustment mechanism, and the elastomer assembly includes an outer ring that encircles an elastomeric material, a central bushing embedded in the elastomeric material, and a plurality of shims embedded in the elastomeric material in a parallel planar fashion. A thin outer airfoil wall is formed over the main body with the filler material filled cells.