A computer-implemented method of performing runtime analysis on and control of a multithreaded computer program. An energy beam is radiated onto a resist-applied target while the energy beam is adjusted to correct the pattern-size variation occurring in the etching process. The drying gas is supplied to the main surface of a substrate being pulled up from de-ionized water stored in a cleaning bath as a stream. Then, a chip edge at which the drain electrode is disposed on top of the chip is put in contact with the inner wall of the recess, which is closer to the drain bonding pad.