A relay board provided in a semiconductor device includes a first terminal, and a plurality of second terminals connecting to the first terminal by a wiring. Some embodiments of the invention provide a two-layered data structure to store multidimensional data tuples that are defined in a multidimensional data space. The cold plate base is fastened under the printed wiring board assembly for dissipating heat generated by the printed wiring board assembly. Soybean seed, cells, plants, germplasm, breeding lines, varieties, and plant parts produced by these methods andor derived from soybean variety XB39C10 are further provided. The connector body has an external groove sized to receive the band, and the outer surface of the band can be of different configurations or designs, such as, flat or ribbed. In order to determine the leak, the pressure is determined, if appropriate as a function of time, in a control volume between a first valve-rod seal and a second valve-rod seal, and the leak flow rate is calculated therefrom.