Disclosed is a mobile communication device comprising a slide cover being longitudinally slid towards or away from a main body of the mobile communication device according to use of the mobile communication device. A chip is held on a chip mount by a chuck and is heated from a side facing away from the wafer by means of a radiation source, so that a solder applied to a side facing the wafer is melted. A stop member is disposed to engage the bottle within the chute, the stop member being biased to allow the bottle to pass in one direction, but to move into and grip the bottle if the bottle is moved in the other direction.