Method and apparatus for designing an integrated circuit by calculating an optimised reticle layout design from an IC layout design and a model describing an optical system for transferring the IC layout design onto a semiconductor wafer using a reticle, wherein the IC layout design comprises features defined by a plurality of boundaries. The electroconductive paste composition includes electroconductive metal particles, glass powder, at least one metal oxide powder and an organic vehicle. Along a binding process path are provided a sheave transporter for transporting the sheaves and, at the downstream end of the bundlerstacker, an adhesive applicator in an adhesive-application position and a front-cover binder in a front-cover binding position. Thus, if twenty subsets are selected by the user from the aggregate brain activity data, then twenty different visual displays will be selectively generated and sequentially displayed in response to a single user request. Memory position of the back image data may be written into a back description domain according to a second byte number of the back image data.