A cell of a semiconductor device includes a substrate portion formed to include a plurality of diffusion regions, including at least one p-type diffusion region and at least one n-type diffusion region separated from each other by one or more non-active regions. Moreover, moisture, when present in the dissolving system for treating an electrical equipment including an electroconductive material of aluminum, may react with aluminum to produce an aluminate compound which is transformed into aluminum oxide under heating, which, in turn, may cause abnormal temperature rise to melt aluminum. The mixture is polymerized, and the resulting polymer is mixed with a free radical source, and optionally an addition fragmentation agent under cleavage conditions. In some embodiments, the wound cover can be configured to move between at least the relatively rigid, generally raised position and the relatively flexible, generally collapsed position by adjusting the air pressure in one or more channels in the wound cover or by adjusting the length of piezoelectric or other length changing material supported by the wound cover. The valve prevents the flow of material out of the access cannula. The present invention also provides a fastening device having a hook fastening component and a female component that comprises the multi-layer female component of the present invention.