A bump electrode is formed on an electrode pad using a Cu core ball in which a core material is covered with solder plating, and a board which has bump electrodes such as semiconductor chip or printed circuit board mounts such a bump electrode. Electrical contact elements of an intermediate set are disposed on the molding compound. The initial communication frame includes a frame preamble, first data and a first switch point. Above the upper-basis, a \u201cU\u201d structure is developed with a quadratic profile that has four hooks in its upper vertexes, with concave upper portion and convex bottom portion, being one of these hooks equipped, at the head and in material continuity, by a spherical hook preceded by a connection segment with rectangular flat profile. The container may further comprise a sensor means for temperature, blood pressure, and blood chemistry data including blood glucose, creatinine and others which may all be transmitted wirelessly . A service provision method includes transmitting a terminal search request message including a contents information element to a service provision server, receiving positional information of a terminal, which is playing first contents related to the contents information element, from the service provision server, and displaying the received positional information.