An integration system for obtaining a set of overlay offset parameters of a first process layer which is going to be formed in an assigned photolithography tool with an assigned mask and an assigned pre-tool. The base supports an amount of paper, and defines a first slot. Other inventive aspects are directed to features of the support assemblies and heads thereof. Increasing the thickness without substantially increasing convection results in a better insulator and an improvement in the ability to retain heat. The first and second elements are bonded by applying a reflow act whereby the solder balls melt and form a joined solder ball structure.