A transport and storage carrier for semiconductor members including wafers which is characterized in that the carrier is molded from a resin composition comprising a synthetic resin having a melting temperature of at least 300\xb0 C. Using information derived from the annotation of said calcific deposits, the method further comprises calculating a measure reflecting either one or both of a) the aggregate of the deviations from roundness of individual calcific deposits, and b) up to at least a threshold value, the extent to which the separate calcific deposits are spaced from one another. The base portion has an upper end, a lower end, a bottom having a first thickness and a continuous sidewall extending generally between the upper and lower ends of the base portion. Interaction means are provided to the user in the Burst-message, for the interaction of the user with the Burst-message andor with the Web-site.