A method of forming a semiconducting wafer is provided that utilizes fewer processing operations, reduces process variation, and lowers cost as well as production time. The controller determines based on the target and the actual value, in conjunction with controller characteristic, a controlled variable for the machining device and outputs the controlled variable to the machining device which machines the roll product according to the output controlled variable. The alloy comprises, by weight, 9. The apparatus comprises a camera, carried by the individual, for obtaining an image of a scene viewed by the individual; a display carried by the individual; an image modification input device carried by the individual; and a processor, carried by the individual.