A heat sensing device manager system and method for processing signals from heat sensing devices used to monitor the semiconductor processing environment. A method includes forming a mask above the semiconductor wafer, the mask including a layer covering and protecting the integrated circuits. By providing a main control board and a sensing plate in the rotary table, a result is show on a display. Using the patterned conductor layer as mask, a patterned photoresist layer is formed on the etching stop material layer through a back exposure process. A method for fabricating the silicon-on-insulator semiconductor device is further disclosed. The emergency signal emitting mechanism also includes sensors that activate the system when the vehicle ignition is turned off.