A wiring board including a built-in semiconductor element includes the semiconductor element, a peripheral insulating layer covering an outer peripheral side surface of the semiconductor element, an upper surface-side wiring provided on an upper surface side of the wiring board, and a lower surface-side wiring provided on a lower surface side of the wiring board. A second gate material layer is located over the first gate stack and a laterally adjacent second orientation region of the semiconductor substrate. Each of the inlet and outlet valves includes a cage having an open top and an open bottom to allow fluid passage therethrough, the cage having a seat formed therein for receiving a diaphragm member. The pilot-operated check valves are located in different passages that extend to areas located on opposite sides of the piston.