A package for a microelectronic die includes a first substrate adjacent to a first surface of the die, a second substrate adjacent to the first substrate, and a heat spreader adjacent to a second surface of the die. The system has a communication module for receiving a content source identifier from a client looking to access a specific content source, and a data table containing pointers to server clusters associated with the desired content source. Accordingly, a target compound can be produced in a high yield with high quality, from which the catalyst can be easily removed.