A coated abrasive product, comprising a first section and a second section, the first and the second sections being continuously joined together by a splice. The laser is useful as a light source for very rapid inspections of wafers in an integrated circuit fabrication process. Within the FOV of the image formation and detection subsystem, the narrow-band illumination subsystem produces a field of narrow-band illumination consisting essentially of a narrow band of wavelengths of visible illumination. At least one of the second electronic components has a height over the second side of the PCB that is higher than the height of the first electronic components.