A bonding apparatus including a capillary 40 having a high-frequency coil 50 on its tip end portion and allowing a bonding wire 2 to pass therethrough, a position changing unit for changing the position of the tip of the bonding wire, a gas supply unit for supplying gas into the capillary, and a high-frequency power supply unit for supplying high-frequency power to the high-frequency coil. In addition, a current-detecting resistor is inserted in series between a high-voltage site and an output terminal of a power circuit that supplies a predetermined direct voltage to the high-voltage site. Data may be validated to ensure that offer terms associated with the offer are satisfied.