A process of removing photoresist, previously subjected to ion implantation, from the surface of a workpiece. Two quantities of absorbent material are disposed in a hollow container, such as a pipe section, and spaced apart such that they may be readily separated for analysis. The printed test sheet is scanned, and from the scanned test sheet, at least one of the multiple void pantographs having an overt pantograph foreground is identified. When the inner bar slides towards the second end of the outer bar, a plug, which is attached to the inner bar, is adapted to abut a plug barrier thereby preventing the inner bar from sliding towards the second end. The conductive metal ring grounding member is configured to maintain electrical grounding.