1461000023-994fdd31-d315-41ef-a670-e337c7e98d19

A method for manufacturing a semiconductor device having on a silicon substrate semiconductor elements and aluminum alloy wiring leads as electrically connected thereto is disclosed. The inner bore is exposed after part of the cylinder body of the ferrule is cut away, forming a connecting platform. The process according to the invention is based on coating, upstream of the printing head, of the polymer strand used for producing the actual object, and on fixing of the coating upstream of entry of the polymer strand into the printing head. The present invention provides a flash unit, a camera device, and a mobile terminal having a small dimension so as to provide a flash unit having an increased flash light.