CMP systems and methods implement instructions for moving a polishing pad relative to a wafer and a retainer ring and for applying pressure for CMP operations. One such texture circuit can provide a configurable number of texel quads for a configurable number of pixels. The inner member includes mounting ears that extend through openings in the outer member to releasably secure the inner member to the outer member. Down selection by a controller allows the shifter blocks to be implemented with narrow band multiplexers, which conserves both chip space and power. Clips can also be included to secure the device to the external portion of the golf bag.